View MT4LC8M8B6DJ-5S_1982142.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram features ? single +3.3v 0.3v power supply industry-standard x8 pinout, timing, functions, and packages 13 row, 10 column addresses (e1) or 12 row, 11 column addresses (b6) high-performance cmos silicon-gate process all inputs, outputs and clocks are lvttl- compatible fast page mode (fpm) access 4,096-cycle cas#-before-ras# (cbr) refresh distributed across 64ms optional self refresh (s) for low-power data retention options marking refresh addressing 4,096 (4k) rows b6 8,192 (8k) rows e1 plastic packages 32-pin soj (400 mil) dj 32-pin tsop (400 mil) tg timing 50ns access -5 60ns access -6 refresh rates standard refresh (64ms period) none self refresh (128ms period) s* note: 1. the 8 meg x 8 fpm dram base number differentiates the offerings in one place? mt4lc8m8 e1. the fifth field distinguishes various options: e1 designates an 8k refresh and b6 designates a 4k refresh for fpm drams. 2. the # symbol indicates signal is active low. *contact factory for availability part number example: mt4lc8m8e1dj-5 dram mt4lc8m8e1, mt4lc8m8b6 for the latest data sheet, please refer to the micron web site: www.micron.com/products/datasheets/dramds.html 8 meg x 8 fpm dram part numbers refresh part number addressing package refresh mt4lc8m8e1dj-x 8k soj standard mt4lc8m8e1dj-x s 8k soj self mt4lc8m8e1tg-x 8k tsop standard mt4lc8m8e1tg-x s 8k tsop self mt4lc8m8b6dj-x 4k soj standard mt4lc8m8b6dj-x s 4k soj self mt4lc8m8b6tg-x 4k tsop standard mt4lc8m8b6tg-x s 4k tsop self x = speed **a12 on e1 version, nc on b6 version 32-pin tsop v cc dq0 dq1 dq2 dq3 nc v cc we# ras# a0 a1 a2 a3 a4 a5 v cc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 v ss dq7 dq6 dq5 dq4 v ss cas# oe# nc/ a12 ** a11 a10 a9 a8 a7 a6 v ss 32-pin soj v cc dq0 dq1 dq2 dq3 nc v cc we# ras# a0 a1 a2 a3 a4 a5 v cc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 v ss dq7 dq6 dq5 dq4 vss cas# oe# nc / a12 ** a11 a10 a9 a8 a7 a6 v ss pin assignment (top view) key timing parameters speed t rc t rac t pc t aa t cac -5 90ns 50ns 30ns 25ns 13ns -6 110ns 60ns 35ns 30ns 15ns general description the 8 meg x 8 drams are high-speed cmos, dy- namic random-access memory devices containing 67,108,864 bits organized in a x8 configuration. the 8 meg x 8 drams are functionally organized as 8,388,608 locations containing eight bits each. the 8,388,608 memory locations are arranged in 8,192 rows by 1,024 columns for the mt4lc8m8e1 or 4,096 rows by 2,048 columns for the mt4lc8m8b6. during read or write cycles, each location is uniquely addressed via the address bits. first, the row address is latched by the
2 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram functional block diagram mt4lc8m8e1 (13 row addresses) functional block diagram mt4lc8m8b6 (12 row addresses) a0- a12 ras# 13 13 10 no. 2 clock generator refresh controller no. 1 clock generator v dd v ss 13 we# cas# 10 control logic column- address buffer(10) row- address buffers (13) 8,192 1,024 column decoder oe# dq0- dq7 8 8 8 8 refresh counter row select row decoder sense amplifiers i/o gating data-out buffer data-in buffer 8,192 x 1,024 x 8 memory array complement select 1,024 x 8 8,192 x 8 a0- a11 ras# 12 12 11 no. 2 clock generator refresh controller no. 1 clock generator v dd v ss 12 we# cas# 11 control logic column- address buffer(11) row- address buffers (12) 4,096 2,048 column decoder oe# dq0- dq7 8 8 8 8 refresh counter row select row decoder sense amplifiers i/o gating data-out buffer data-in buffer 4,096 x 2,048 x 8 memory array complement select 2,048 x 8 4,096 x 8
3 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram ras# signal, then the column address by cas#. both devices provide fast-page-mode operation, allow- ing for fast successive data operations (read, write, or read-modify-write) within a given row. the mt4lc8m8e1 and mt4lc8m8b6 must be re- freshed periodically in order to retain stored data. fast page mode access each location in the dram is uniquely addressable as mentioned in the general description. the data for each location is accessed via the eight i/o pins (dq0- dq7). the we# signal must be activated to execute a write operation; otherwise, a read operation will be performed. the oe# signal must be activated to enable the dq output drivers for a read access and can be deactivated to disable output data if necessary. fast-page-mode operations are always initiated with a row address strobed in by the ras# signal, followed by a column address strobed in by cas#, just like for single location accesses. however, subsequent column locations within the row may then be accessed at the page mode cycle time. this is accomplished by cycling cas# while holding ras# low and entering new column addresses with each cas# cycle. returning ras# high terminates the fast-page-mode opera- tion. dram refresh the supply voltage must be maintained at the speci- fied levels, and the refresh requirements must be met in order to retain stored data in the dram. the refresh requirements are met by refreshing all 8,192 rows (e1) or all 4,096 rows (b6) in the dram array at least once every 64ms. the recommended procedure is to execute 4,096 cbr refresh cycles, either uniformly spaced or grouped in bursts, every 64ms. the mt4lc8m8e1 in- ternally refreshes two rows for every cbr cycle, whereas the mt4lc8m8b6 refreshes one row for every cbr cycle. so with either device, executing 4,096 cbr cycles covers all rows. the cbr refresh cycle will invoke the internal refresh counter for automatic ras# address- ing. alternatively, ras#-only refresh capability is inherently provided. however, with this method only one row is refreshed at a time; so for the mt4lc8m8e1, 8,192 ras#-only refresh cycles must be executed every 64ms to cover all rows. some compatibility issues may become apparent. jedec strongly recommends the use of cbr refresh for this device. an optional self refresh mode is also available on the ?s? version. the self refresh feature is initiated by performing a cbr refresh cycle and holding ras# low for the specified t rass. the ?s? option allows for an extended refresh period of 128ms, or 31.25s per row for a 4k refresh and 15.625s per row for an 8k refresh when using a distributed cbr refresh. this refresh rate can be applied during normal operation, as well as during a standby or battery backup mode. the self refresh mode is terminated by driving ras# high for a minimum time of t rps. this delay allows for the completion of any internal refresh cycles that may be in process at the time of the ras# low-to-high transition. if the dram controller uses a distributed cbr refresh sequence, a burst refresh is not required upon exiting self refresh. however, if the dram con- troller utilizes ras#-only or burst cbr refresh se- quence, all rows must be refreshed with a refresh rate of t rc minimum prior to the resumption of normal operation. standby returning ras# and cas# high terminates a memory cycle and decreases chip current to a reduced standby level. the chip is preconditioned for the next cycle during the ras# high time. general description (continued)
4 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram absolute maximum ratings* voltage on v cc relative to v ss ................ -1v to +4.6v voltage on nc, inputs or i/o pins relative to v ss ....................................... -1v to +4.6v operating temperature, t a (ambient) ... 0c to +70c storage temperature (plastic) ............ -55c to +150c power dissipation ................................................... 1w *stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. dc electrical characteristics and operating conditions (notes: 1, 5, 6) (v cc = +3.3v 0.3v) parameter/condition symbol min max units notes supply voltage v cc 3 3.6 v input high voltage: valid logic 1; all inputs, i/os and any nc v ih 2v cc + 0.3 v 26 input low voltage: valid logic 0; all inputs, i/os and any nc v il -0.3 0.8 v 26 input leakage current: any input at v in (0v v in v cc + 0.3v); i i -2 2 a all other pins not under test = 0v output high voltage: i out = -2ma v oh 2.4 ? v output low voltage: i out = 2ma v ol ? 0.4 v output leakage current: any output at v out (0v v out v cc + 0.3v); i oz -5 5 a dq is disabled and in high-z state
5 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram i cc operating conditions and maximum limits (notes: 1, 2, 3, 5, 6) (v cc = +3.3v 0.3v) 4k 8k parameter/condition symbol speed refresh refresh units notes standby current: ttl i cc 1 all 1 1 ma (ras# = cas# = v ih ) standby current: cmos (ras# = cas# ? v cc - 0.2v; dqs may be left open; i cc 2 all 500 500 a other inputs: v in v cc - 0.2v or v in 0.2v) operating current: random read/write i cc 3 -5 175 135 ma 25 average power supply current -6 165 125 (ras#, cas#, address cycling: t rc = t rc [min]) operating current: fast page mode i cc 4 -5 105 105 ma 25 average power supply current (ras# = v il ,-69595 cas#, address cycling: t pc = t pc [min]) refresh current: ras#-only i cc 5 -5 175 135 ma 22 average power supply current -6 165 125 (ras# cycling, cas# = v ih : t rc = t rc [min]) refresh current: cbr i cc 6 -5 175 175 ma 4, 7 average power supply current -6 165 165 (ras#, cas#, address cycling: t rc = t rc [min]) refresh current: extended ( ? s ? version only) average power supply current: cas# = 0.2v or cbr cycling; ras# = t ras (min); we# = v cc - 0.2v; i cc 7 all 400 400 a 4, 7 a0-a11, oe# and d in = v cc - 0.2v or 0.2v (d in may be left open) refresh current: self ( ? s ? version only) average power supply current: cbr with i cc 8 all 400 400 a 4, 7 ras# t rass (min) and cas# held low; we# = v cc - 0.2v; a0-a11, oe# and d in = v cc - 0.2v or 0.2v (d in may be left open)
6 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram capacitance (note: 2) parameter symbol max units input capacitance: address pins c i 1 5pf input capacitance: ras#, cas#, we#, oe# c i 2 7pf input/output capacitance: dq c io 7pf ac electrical characteristics (notes: 5, 6, 7, 8, 9, 10, 11, 12) (v cc = +3.3v 0.3v) ac characteristics -5 -6 parameter symbol min max min max units notes access time from column address t aa 25 30 ns column-address hold time (referenced to ras#) t ar 40 45 ns column-address setup time t asc 0 0 ns row-address setup time t asr 0 0 ns column address to we# delay time t awd 48 55 ns 18 access time from cas# t cac 13 15 ns column-address hold time t cah 8 10 ns cas# pulse width t cas 13 10,000 15 10,000 ns cas# low to ? don ? t care ? during self refresh t chd 15 15 ns cas# hold time (cbr refresh) t chr 15 15 ns 4 cas# to output in low-z t clz 3 3 ns cas# precharge time (fast page mode) t cp 8 10 ns 13 access time from cas# precharge t cpa 30 35 ns cas# to ras# precharge time t crp 5 5 ns cas# hold time t csh 50 60 ns cas# setup time (cbr refresh) t csr 5 5 ns 4 cas# to we# delay time t cwd 36 40 ns 18 write command to cas# lead time t cwl 13 15 ns data-in hold time t dh 8 10 ns 19 data-in setup time t ds 0 0 ns 19 output disable t od 3 13 3 15 ns 23, 24 output enable time t oe 13 15 ns 20 oe# hold time from we# during t oeh 13 15 ns 24 read-modify-write cycle output buffer turn-off delay t off 3 13 3 15 ns 17, 23 oe# setup prior to ras# during t ord 0 0 ns hidden refresh cycle fast-page-mode read or write cycle time t pc 30 35 ns fast-page-mode read-write cycle time t prwc 76 85 ns access time from ras# t rac 50 60 ns
7 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram ac electrical characteristics (notes: 5, 6, 7, 8, 9, 10, 11, 12) (v cc = +3.3v 0.3v) ac characteristics -5 -6 parameter symbol min max min max units notes ras# to column-address delay time t rad 13 15 ns 15 row-address hold time t rah 8 10 ns ras# pulse width t ras 50 10,000 60 10,000 ns ras# pulse width (fast page mode) t rasp 50 125,000 60 125,000 ns ras# pulse width during self refresh t rass 100 100 s random read or write cycle time t rc 90 110 ns ras# to cas# delay time t rcd 18 20 ns 14 read command hold time (referenced to cas#) t rch 0 0 ns 16 read command setup time t rcs 0 0 ns refresh period t ref 64 64 ms 22 refresh period (2,048 cycles) ? s ? version t ref 128 128 ms ras# precharge time t rp 30 40 ns ras# to cas# precharge time t rpc 5 5 ns ras# precharge time exiting self refresh t rps 90 105 ns read command hold time (referenced to ras#) t rrh 0 0 ns 16 ras# hold time t rsh 13 15 ns read-write cycle time t rwc 131 155 ns ras# to we# delay time t rwd 73 85 ns 18 write command to ras# lead time t rwl 13 15 ns transition time (rise or fall) t t250250ns write command hold time t wch 8 10 ns write command hold time (referenced to ras#) t wcr 40 45 ns we# command setup time t wcs 0 0 ns 18 write command pulse width t wp 8 10 ns we# hold time (cbr refresh) t wrh 10 10 ns we# setup time (cbr refresh) t wrp 10 10 ns
8 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram notes 1. all voltages referenced to v ss . 2. this parameter is sampled. v cc = +3.3v; f = 1 mhz. 3. i cc is dependent on output loading and cycle rates. specified values are obtained with mini- mum cycle time and the outputs open. 4. enables on-chip refresh and address counters. 5. the minimum specifications are used only to indicate cycle time at which proper operation over the full temperature range is ensured. 6. an initial pause of 100s is required after power- up, followed by eight ras# refresh cycles (ras#- only or cbr with we# high), before proper device operation is ensured. the eight ras# cycle wake-ups should be repeated any time the t ref refresh requirement is exceeded. 7. ac characteristics assume t t = 5ns. 8. v ih (min) and v il (max) are reference levels for measuring timing of input signals. transition times are measured between v ih and v il (or between v il and v ih ). 9. in addition to meeting the transition rate specification, all input signals must transit between v ih and v il (or between v il and v ih ) in a monotonic manner. 10. if cas# = v ih , data output is high-z. 11. if cas# = v il , data output may contain data from the last valid read cycle. 12. measured with a load equivalent to two ttl gates, 100pf and v ol = 0.8v and v oh = 2v. 13. if cas# is low at the falling edge of ras#, output data will be maintained from the previous cycle. to initiate a new cycle and clear the data- out buffer, cas# must be pulsed high for t cp. 14. the t rcd (max) limit is no longer specified. t rcd (max) was specified as a reference point only. if t rcd was greater than the specified t rcd (max) limit, then access time was controlled exclusively by t cac ( t rac [min] no longer applied). with or without the t rcd limit, t aa and t cac must always be met. 15. the t rad (max) limit is no longer specified. t rad (max) was specified as a reference point only. if t rad was greater than the specified t rad (max) limit, then access time was controlled exclusively by t aa ( t rac and t cac no longer applied). with or without the t rad (max) limit, t aa, t rac and, t cac must always be met. 16. either t rch or t rrh must be satisfied for a read cycle. 17. t off (max) defines the time at which the output achieves the open circuit condition and is not referenced to v oh or v ol . 18. t wcs, t rwd, t awd, and t cwd are not restrictive operating parameters. t wcs applies to early write cycles. if t wcs > t wcs min, the cycle is an early write cycle and the data output will remain an open circuit throughout the entire cycle. t rwd, t awd and t cwd define read- modify-write cycles. meeting these limits allows for reading and disabling output data and then applying input data. the values shown were calculated for reference allowing 10ns for the external latching of read data and application of write data. oe# held high and we# taken low after cas# goes low result in a late write (oe#-controlled) cycle. t wcs, t rwd, t cwd and t awd are not applicable in a late write cycle. 19. these parameters are referenced to cas# leading edge in early write cycles and we# leading edge in late write or read-modify-write cycles. 20. if oe# is tied permanently low, late write or read-modify-write operations are not possible. 21. a hidden refresh may also be performed after a write cycle. in this case, we# = low and oe# = high. 22. ras#-only refresh requires that all 8,192 rows of the mt4lc8m8e1 or all 4,096 rows of the mt4lc8m8b6 be refreshed at least once every 64ms. cbr refresh for either device requires that at least 4,096 cycles be completed every 64ms. 23. the dqs open during read cycles once t od or t off occurs. if cas# goes high before oe#, the dqs will open regardless of the state of oe#. if cas# stays low while oe# is brought high, the dqs will open. if oe# is brought back low (cas# still low), the dqs will provide the previously read data. 24. late write and read-modify-write cycles must have both t od and t oeh met (oe# high during write cycle) in order to ensure that the output buffers will be open during the write cycle. if oe# is taken back low while cas# remains low, the dqs will remain open. 25. column address changed once each cycle. 26. v ih overshoot: v ih (max) = v cc + 2v for a pulse width 10ns, and the pulse width cannot be greater than one third of the cycle rate. v il undershoot: v il (min) = -2v for a pulse width 10ns, and the pulse width cannot be greater than one third of the cycle rate.
9 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram read cycle t rrh t clz t cac t rac t aa valid data open t off t rch row t rcs t asc t rah t rad t ar t cah t rcd t cas t rsh t csh t rp t rc t ras t crp t asr row open ras# v v ih il cas# v v ih il addr v v ih il dq v v ioh iol v v ih il column we# don ? t care undefined -5 -6 symbol min max min max units t off 3 13 3 15 ns t rac 50 60 ns t rad 13 15 ns t rah 8 10 ns t ras 50 10,000 60 10,000 ns t rc 90 110 ns t rcd 18 20 ns t rch 0 0 ns t rcs 0 0 ns t rp 30 40 ns t rrh 0 0 ns t rsh 13 15 ns timing parameters -5 -6 symbol min max min max units t aa 25 30 ns t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t cac 13 15 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t clz 3 3 ns t crp 5 5 ns t csh 50 60 ns t od 3 13 3 15 ns t oe 13 15 ns
10 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram early write cycle don ? t care undefined v v ih il cas# valid data row column row t ds t dh t wp t wch t wcs t wcr t rwl t cwl t cah t asc t rah t asr t rad t ar t cas t rsh t csh t rcd t crp t ras t rc t rp v v ih il addr v v ih il we# v v ih il dq v v ioh iol ras# -5 -6 symbol min max min max units t rah 8 10 ns t ras 50 10,000 60 10,000 ns t rc 90 110 ns t rcd 18 20 ns t rp 30 40 ns t rsh 13 15 ns t rwl 13 15 ns t wch 8 10 ns t wcr 40 45 ns t wcs 0 0 ns t wp 8 10 ns timing parameters -5 -6 symbol min max min max units t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t crp 5 5 ns t csh 50 60 ns t cwl 13 15 ns t dh 8 10 ns t ds 0 0 ns t rad 13 15 ns
11 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram read-write cycle (late write and read-modify-write cycles) valid d out valid d in row column row v v ih il cas# v v ih il addr v v ih il v v ih il dq v v ioh iol v v ih il ras# open open t oe t od t cac t rac t aa t clz t ds t dh t awd t wp t rwl t cwl t cwd t rwd t rcs t asc t cah t ar t asr t rad t crp t rcd t cas t rsh t csh t ras t rwc t rp t rah oe# t oeh we# don ? t care undefined t od 3 13 3 15 ns t oe 13 15 ns t oeh 13 15 ns t rac 50 60 ns t rad 13 15 ns t rah 8 10 ns t ras 50 10,000 60 10,000 ns t rcd 18 20 ns t rcs 0 0 ns t rp 30 40 ns t rsh 13 15 ns t rwc 131 155 ns t rwd 73 85 ns t rwl 13 15 ns t wp 8 10 ns timing parameters -5 -6 symbol min max min max units t aa 25 30 ns t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t awd 48 55 ns t cac 13 15 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t clz 3 3 ns t crp 5 5 ns t csh 50 60 ns t cwd 36 40 ns t cwl 13 15 ns t dh 8 10 ns t ds 0 0 ns -5 -6 symbol min max min max units
12 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram valid data valid data valid data column column column row row t rcs t cah t asc t cp t cas t rsh t cp t cas t cp t cas t rcd t crp t pc t csh t rasp t rp t cah t asc t cah t asc t ar t rah t rad t asr t rcs t rch t rch t rcs t rrh t rch t off t cac t cpa t aa t clz t off t cac t cpa t aa t clz t off t cac t rac t aa t clz t oe t od t oe t od t oe t od open open v v ih il cas# v v ih il addr v v ih il we# v v ih il dq v v ioh iol v v ih il ras# oe# don ? t care undefined fast-page-mode read cycle -5 -6 symbol min max min max units t oe 13 15 ns t off 3 13 3 15 ns t pc 30 35 ns t rac 50 60 ns t rad 13 15 ns t rah 8 10 ns t rasp 50 125,000 60 125,000 ns t rcd 18 20 ns t rch 0 0 ns t rcs 0 0 ns t rp 30 40 ns t rrh 0 0 ns t rsh 13 15 ns timing parameters -5 -6 symbol min max min max units t aa 25 30 ns t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t cac 13 15 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t clz 3 3 ns t cp 8 10 ns t cpa 30 35 ns t crp 5 5 ns t csh 50 60 ns t od 3 13 3 15 ns
13 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram fast-page-mode early write cycle t ds t dh t ds t dh t ds t dh t wcr valid data valid data valid data t rwl t wp t cwl t wch t wcs t wp t cwl t wch t wcs t wp t cwl t wch t wcs t cah t asc t cah t asc t cah t asc t rah t asr t rad t ar column column column row row t cp t cas t rsh t cp t cas t cp t cas t rcd t crp t pc t csh t rasp t rp v v ih il cas# v v ih il addr v v ih il we# v v ih il dq v v ioh iol ras# oe# v v ih il don?t care undefined -5 -6 symbol min max min max units t rad 13 15 ns t rah 8 10 ns t rasp 50 125,000 60 125,000 ns t rcd 18 20 ns t rp 30 40 ns t rsh 13 15 ns t rwl 13 15 ns t wch 8 10 ns t wcr 40 45 ns t wcs 0 0 ns t wp 8 10 ns timing parameters -5 -6 symbol min max min max units t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t cp 8 10 ns t crp 5 5 ns t csh 50 60 ns t cwl 13 15 ns t dh 8 10 ns t ds 0 0 ns t pc 30 35 ns
14 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram don ? t care undefined t oe t oe t oe open d out valid d in valid d out valid d in valid d out valid d in valid open t dh t ds t aa t cpa t clz t cac t dh t ds t aa t cpa t clz t cac t dh t ds t aa t clz t cac t rac t wp t cwl t rwl t cwd t awd t wp t cwl t cwd t awd t wp t cwl t cwd t awd t rcs t rwd t asr t rah t asc t rad t ar t cah t asc t cah t asc t cah t cp t cas t rsh t cp t rp t rasp t cas t cp t cas t rcd t csh t pc note 1 t crp row column column column row v v ih il cas# v v ih il addr v v ih il v v ih il dq v v ioh iol v v ih il ras# oe# we# t prwc t oeh t od t od t od fast-page-mode read-write cycle (late write and read-modify-write cycles) note: 1. t pc is for late write only. -5 -6 symbol min max min max units t od 3 13 3 15 ns t oe 13 15 ns t oeh 13 15 ns t pc 30 35 ns t prwc 76 85 ns t rac 50 60 ns t rad 13 15 ns t rah 8 10 ns t rasp 50 125,000 60 125,000 ns t rcd 18 20 ns t rcs 0 0 ns t rp 30 40 ns t rsh 13 15 ns t rwd 73 85 ns t rwl 13 15 ns t wp 8 10 ns timing parameters -5 -6 symbol min max min max units t aa 25 30 ns t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t awd 48 55 ns t cac 13 15 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t clz 3 3 ns t cp 8 10 ns t cpa 30 35 ns t crp 5 5 ns t csh 50 60 ns t cwd 36 40 ns t cwl 13 15 ns t dh 8 10 ns t ds 0 0 ns
15 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram fast-page-mode read early write cycle (pseudo read-modify-write) row valid data valid data open t crp t rcd t cas t rsh t rasp t rp t pc t asc t cah t ar t asr t rad t rah t wcs t wp t rwl t rcs t dh t ds t cac t off v v ih il cas# v v ih il addr v v ih il ras# dq v v oh ol we# v v ih il t csh column t cp t cp t asc t cah t cwl t wch t clz t aa rac don ? t care undefined t note 1 row column t cas note: 1. do not drive input data prior to output data going high-z. -5 -6 symbol min max min max units t off 3 13 3 15 ns t pc 30 35 ns t rac 50 60 ns t rad 13 15 ns t rah 8 10 ns t rasp 50 125,000 60 125,000 ns t rcd 18 20 ns t rcs 0 0 ns t rp 30 40 ns t rsh 13 15 ns t rwl 13 15 ns t wch 8 10 ns t wcs 0 0 ns t wp 8 10 ns timing parameters -5 -6 symbol min max min max units t aa 25 30 ns t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t cac 13 15 ns t cah 8 10 ns t cas 13 10,000 15 10,000 ns t clz 3 3 ns t cp 8 10 ns t crp 5 5 ns t csh 50 60 ns t cwl 13 15 ns t dh 8 10 ns t ds 0 0 ns
16 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram t rp v v ih il ras# t ras open t chr t csr v v ih il v v oh ol cas# dq t rp t ras t rpc t csr t rpc t chr t cp v v ih il t wrp t wrh t wrp t wrh we# don ? t care undefined note 1 ras#-only refresh cycle (oe# and we# = don ? t care) row v v ih il cas# v v ih il addr v v ih il ras# t rc t ras t rp t crp t asr t rah row open dq v v oh ol t rpc cbr refresh cycle (addresses and oe# = don ? t care) -5 -6 symbol min max min max units t ras 50 10,000 60 10,000 ns t rc 90 110 ns t rp 30 40 ns t rpc 5 5 ns t wrh 10 10 ns t wrp 10 10 ns timing parameters -5 -6 symbol min max min max units t asr 0 0 ns t chr 15 15 ns t cp 8 10 ns t crp 5 5 ns t csr 5 5 ns t rah 8 10 ns note: 1. end of cbr refresh cycle.
17 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram hidden refresh cycle 1 (we# = high; oe# = low) don ? t care undefined t clz t off open valid data open column row t cac t rac t aa t cah t asc t rah t asr t rad t ar t crp t rcd t rsh t ras t rp t chr t ras dq v v ioh iol v v ih il addr v v ih il cas# v v ih il ras# v v ih il t oe t od oe# t ord -5 -6 symbol min max min max units t oe 13 15 ns t off 3 13 3 15 ns t ord 0 0 ns t rac 50 60 ns t rad 13 15 ns t rah 8 10 ns t ras 50 10,000 60 10,000 ns t rcd 18 20 ns t rp 30 40 ns t rsh 13 15 ns timing parameters -5 -6 symbol min max min max units t aa 25 30 ns t ar 40 45 ns t asc 0 0 ns t asr 0 0 ns t cac 13 15 ns t cah 8 10 ns t chr 15 15 ns t clz 3 3 ns t crp 5 5 ns t od 3 13 3 15 ns note: 1. a hidden refresh may also be performed after a write cycle. in this case, we# = low and oe# = high.
18 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram self refresh cycle (addresses and oe# = don ? t care) v v ih il ras# t rass open v v ih il v v oh ol dq t rpc t chd t rps t rpc t rp t cp cas# we# v v ih il t wrh t wrp t wrh t wrp ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) note 1 t csr don ? t care undefined t cp note 2 ( ) ( ) ( ) ( ) note: 1. once t rass (min) is met and ras# remains low, the dram will enter self refresh mode. 2. once t rps is satisfied, a complete burst of all rows should be executed if ras#-only or burst cbr is used. -5 -6 symbol min max min max units t rpc 5 5 ns t rps 90 105 ns t wrh 10 10 ns t wrp 10 10 ns timing parameters -5 -6 symbol min max min max units t chd 15 15 ns t cp 8 10 ns t csr 5 5 ns t rass 100 100 s t rp 30 40 n s
19 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram 32-pin plastic soj (400 mil) .435 (11.05) .360 (9.14) .750 (19.05) typ .829 (21.05) seating plane .040 (1.02) .380 (9.65) .080 (2.03) .095 (2.42) .145 (3.68) .132 (3.35) .015 (0.38) .020 (0.51) pin #1 id .050 (1.27) typ .445 (11.31) .823 (20.90) .405 (10.29) .399 (10.13) .030 (0.77) r .032 (0.82) .037 (0.95) max dambar protrusion .026 (0.67) .024 (0.61) .030 (0.76) min note: 1. all dimensions in inches (millimeters) max or typical where noted. min 2. package width and length do not include mold protrusion; allowable mold protrusion is .01" per side.
20 8 meg x 8 fpm dram micron technology, inc., reserves the right to change products or specifications without notice. d19_2.p65 ? rev. 5/00 ?2000, micron technology, inc. 8 meg x 8 fpm dram 32-pin plastic tsop (400 mil) 0.10 +0.10 -0.05 11.76 0.10 1.20 max 0.50 0.10 gage plane 0.25 see detail a 0.10 0.15 +0.03 -0.02 20.96 0.08 pin 1 id detail a 0.95 10.16 0.08 0.43 +0.07 -0.13 0.80 typ 1.27 typ note: 1. all dimensions in millimeters max or typical where noted. min 2. package width and length do not include mold protrusion; allowable mold protrusion is .25mm per side. 8000 s. federal way, p.o. box 6, boise, id 83707-0006, tel: 208-368-3900 e-mail: prodmktg@micron.com, internet: http://www.micron.com, customer comment line: 800-932-4992 micron is a registered trademark of micron technology, inc.

▲Up To Search▲

Price & Availability of MT4LC8M8B6DJ-5S

	To Download MT4LC8M8B6DJ-5S Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .